Packaging Product Engineer - Wireless Solutions Group (WSG)

Req ID: 4147

As a Wireless Solutions Group (WSG) Packaging Product Engineer at Micron Technology, Inc., you will be responsible for coordinating package development, risk assessment, resources, and analysis up through qualification for WSG packaged products. You will be dedicated to technical details around the New Production Introduction phase of the product lifecycle. In this role, you will work closely with the Product Teams, Key Technology teams, Marketing, and Applications Engineering to ensure that customer packaging expectations are interpreted into a clear manufacturing definition. You will work with various Engineering and Manufacturing groups to ensure definition is proliferated to package design, development, and logistical planning and execution. You will also act as BU point of contact during package development and work with Quality Assurance to ensure package reliability.

Responsibilities will include, but are not limited to, the following:

- Develop, Document, and Communicate Product Definition
- Support the Package Design Process
- Support Sample Deliveries and Qualifications
- Partner with Engineering, Manufacturing, and Marketing
- Provide Technical Training and Expertise

Successful Candidates for this position will have:

- 2+ years experience in any of the following (preferred but not required):
- Semiconductor business
- Semiconductor manufacturing
- General Production/manufacturing experience

- Ability to navigate CAD design applications. A working knowledge of the following (preferred but not required):
- AutoCAD
- Cadence Allegro

- A working knowledge of UNIX, Linux, and Windows operating environments.
- Effective communication skills in written and spoken English
- Good multitasking and organizational skills
- The ability to delegate tasks and set priorities in a team environment
- Excellent problem solving and analytical skills
- Strong presentation skills with PowerPoint and Technical Presentations experience.
- Excellent Project Management skills to include scheduling, materials, and resource allocation. MS Project encouraged.
- Strong documentations skills with an ability to capture customer needs & project requirements and deliverables
- Self-motivated and enthusiasm
- A focus on efficiency
- Ability to apply statistical analysis to design of experiments.
- Manufacturing and/or Semiconductor Packaging experience is desirable by not required.
- Course work in manufacturing processes and Technologies, mechanical design, and material science also desirable.

Education:

Bachelors in Mechanical or Manufacturing Engineering

It has been and will continue to be the policy of Micron to administer all human resource actions and benefits without regard to race, religion, color, sex, national origin, age, disability, sexual orientation, veteran's or other legally-protected status. Each manager, supervisor, and team member is responsible for carrying out this policy.

The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters. To request assistance with the application process, please contact Micron's Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords: Boise -- Idaho (US-ID) -- United States (US) -- WSG -- Experienced -- Regular -- Engineering --.LI-KD1 --